Electronic boards cooling


Electronic components are getting smaller but are still consuming a lot of power, the density of power is therefore very high on specific components such as CPU, FPGA ...

This is why CECLA METAL PROCESS developped specific passive cooling solutions in order to manage this power. This allows us to evacuate the heat of the components in order to guarantee a better efficiency than with a standard cooling solution.


CECLA METAL PROCESS design and manufacture cooling systems using different technologies:

  • Conduction cooled: This type of technologie is used to transfer calories from the components onto cold spot on the side of the boards.
  • HSHP: Heat pipes are integrated into a heat sink base in order to spread the heat all over the heat sink and therefore optimize the efficiency of the heat sink.
  • Heat Sink: A specific and optimized heat sink regarding the power to dissipate.