Electronic boards cooling


Electronic components are getting smaller and smaller but are still consuming a lot of power, the density of power is therefore very high on specific components such as CPU, FPGA ...

This is why CECLA METAL PROCESS developped specific passive cooling systems in order to manage this power. This allow us to evacuate the calories in order to guarantee a better efficience than with a standard cooling system.


CECLA METAL PROCESS design and manufacture cooling systems using different technologies:

  • Drain: This type of technologie is used to transfer calories from the components onto cold spot on the side of the boards.
  • HSHP: Heat pipes are integrated into a heat sink base in order to spread the heat all over the heat sink and therefore optimize the efficiency of the heat sink.
  • Heat Sink: A specific and optimized heat sink regarding the power to dissipate.